Shenzhen Antac Technology Limited
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Light weight Ceramic heat sink heat spreader for Power Module and CPU
Ceramic heatsink’s material is silicon carbide, offers supreme thermal conductivity, electrical insulation, and light– weight, combining efficiency and sustainability in one.
Thanks to non-metallic material characteristics, it has no Electromagnetic Interference (EMI) nor Electromagnetic compatibility (EMD) issues; and it is anti-oxidation, corrosion-resistant, waterproof, electrical isolation and sustainable.
Compared to traditional Aluminum or Copper solutions, it has larger surface area generated by the porous structure and higher level of thermal radiation. It is 30% lighter than Alumninum. A simplified structure has a direct bond between heat-source and heat sink create superior thermal conductivity and electric insulation feature increases components’ life and stability in the entire assembly.