Shenzhen Antac Technology Limited
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The Ceramic Heat Sink is highly durable and long-lasting, providing a reliable solution for all your thermal management needs. It is available in four different colors - green, black, white, and gray - ensuring that you can find the perfect match for your project.
With a density of 3.7g/cm^3, the Ceramic Heat Sink is lightweight and easy to handle. Additionally, it offers a large surface area compared to Aluminium Heat Sinks, allowing for greater heat dissipation capabilities.
The Ceramic Heat Sink has a thermal conductivity range of 9~180 MW/m.K, making it an excellent choice for high-temperature applications that require efficient heat transfer. Its low thermal expansion coefficient ensures that it can withstand extreme temperatures without warping or cracking, making it a reliable and long-lasting solution for your thermal management needs.
In summary, the Ceramic Heat Sink is a top-of-the-line product that offers excellent thermal conductivity, durability, and a large surface area compared to Aluminium Heat Sinks. It is available in four different colors and has a density of 3.7g/cm^3. With a thermal conductivity range of 9~180 MW/m.K and a low thermal expansion coefficient, it is the perfect solution for high-temperature applications that require efficient heat transfer and reliable thermal management.
| Warpage: | ≤2‰ |
| Mechanical Strength: | ≥3000MPa |
| Application: | Transistor, MOSFET, Schottky Diode, IGBT, High-density Switching Power Supply, High-frequency Communication Signal Equipment, High Frequency Welding Machines And Other Electronic Devices |
| Insulation Strength: | ≥15KV/mm |
| Weight: | Lightweight |
| Surface Roughness: | 0.3-0.8 Um |
| Material: | Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃ |
| Heat Dissipation: | Efficient |
| Size: | Various Sizes Available |
| Density: | 3.7g/cm 3 |
Other features of the Ceramic Heat Sink include high breakdown voltage/high resistance, power dissipation of up to 10W, and an open-porous structure that increases air contact area.
Model Number: Ceramic Heat Sink/Ceramic Micro Porous Heat Sink
Place of Origin: China
Certification: ISO9001 , ISO14001, TS16949
Minimum Order Quantity: Low MOQ
Price: Negotiable
Packaging Details: As customer requirements
Delivery Time: 7-15 days
Payment Terms: 30% TT in advance, the balance payment is paid before shipment.
Application:
Surface Roughness: 0.3-08 Um
Color: Green,Black,White,Gray
Durability: Long-lasting
Temperature Resistance: ＜700℃
Product Description:
The Ceramic Heat Sink, also known as the Ceramic Micro Porous Heat Sink, is a high-performance heat sink designed for use in electronic devices such as transistors, MOSFETs, Schottky diodes, IGBTs, high-density switching power supplies, high-frequency communication signal equipment, and high-frequency welding machines. The Ceramic Heat Sink is made of silicon carbide, a high-performance ceramic material that has excellent thermal conductivity and temperature resistance, making it ideal for use in high-temperature environments.
The Ceramic Heat Sink is easy to install and has a simple assembly process, making it an excellent choice for manufacturers who want to reduce production time and costs. The heat sink is also highly reliable, ensuring that electronic devices operate at optimal temperatures and performance levels. The Ceramic Heat Sink is available in green, black, white, and gray and has a surface roughness of 0.3-08 Um.
The Ceramic Heat Sink is a long-lasting and durable product that can withstand high temperatures of up to 700℃. The product is certified with ISO9001, ISO14001, and TS16949, ensuring that it meets the highest manufacturing standards. The Ceramic Heat Sink has a low MOQ, making it an excellent choice for manufacturers who want to order small quantities. The product price is negotiable, and the packaging can be customized according to customer requirements. The delivery time for the Ceramic Heat Sink is 7-15 days, and the payment terms are 30% TT in advance, with the balance payment paid before shipment.