Shenzhen Antac Technology Limited
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But what really sets our Ceramic Heat Sink apart is its exceptional heat dissipation capabilities. Made from a highly thermally conductive material, our heat sink is designed to efficiently transfer heat away from your components, helping to keep them cool and extend their lifespan. And with a density of 3.7g/cm^3, our heat sink is both lightweight and durable, perfect for use in a variety of applications.
And don't forget about the convenience of our included thermally conductive adhesive tape with pull tab for direct IC surface mount. With this tape, you can easily and securely attach our heat sink to your components without the need for messy or time-consuming installation methods. Plus, our tape is non-electrically conductive, meaning you won't have to worry about any interference or "antennae effect" when using our product.
So if you're in need of a reliable and high-performing heat sink solution, look no further than our Ceramic Heat Sink. With its exceptional heat dissipation capabilities, durable construction, and convenient installation options, it's the perfect choice for a wide range of applications.
| Technical Parameters | Description |
|---|---|
| Heat Dissipation | Efficient |
| Thermal Conductivity | 9~180 MW/m.K |
| Weight | Lightweight |
| Mechanical Strength | ≥3000MPa |
| Color | Green,Black,White,Gray |
| Application | Transistor, MOSFET, Schottky Diode, IGBT, High-density Switching Power Supply, High-frequency Communication Signal Equipment, High Frequency Welding Machines And Other Electronic Devices |
| Durability | Long-lasting |
| Surface Roughness | 0.3-08 Um |
| Material | Ceramic, SiC , Al₂O₃ , SiO₂,Al₄C₃ |
| Size | Various Sizes Available |
| Additional Features | With and without thermally conductive Silicone adhesive tape, No antennae effect, Large surface area compared to Aluminium Heat Sinks |
Race Ceramic Heat Sink is a product that is designed to provide good thermal conduction and low thermal expansion coefficient. It is made of high-quality ceramic materials such as Al₂O₃, SiO₂, SiC, and Al₄C₃ that ensures high reliability and durability. The product is manufactured in China, and it has been certified with ISO9001, ISO14001, and TS16949.
The Race Ceramic Heat Sink is an ideal solution for electronic devices that require high-density switching power supply, high-frequency communication signal equipment, high-frequency welding machines, and other electronic devices. The heat sink is suitable for use with various electronic components such as transistors, MOSFET, Schottky diode, IGBT, and more. It can also be used for heat dissipation in power electronics, automotive electronics, and aerospace applications.
The Ceramic Heat Sink is known for its low cost and high reliability. It has a surface roughness of 0.3-08 Um and a warpage of ≤2‰. Its temperature resistance is ＜700℃, which is ideal for high-temperature applications. The minimum order quantity for the product is low, and the price is negotiable.
The packaging details for the Race Ceramic Heat Sink are as per customer requirements, and the delivery time is 7-15 days. The payment terms are 30% TT in advance, and the balance payment is paid before shipment.